Draft CTFE ReWork List February 2001 ECO List for the CTFE Cards --------------------------------------------- Original Rev. Jan-2001 Current Rev. 14-FEB-2001 List of ECO's to the Run I CTFE cards to get them ready for Run II: 1. Ground OpAmp Socket Pins 2. Cut off lead number 5 from the OpAmps 3. Remove the Run I frequency response capacitors 4. Replace the FADC Input Capacitor 5. ReWork the X_Clock Setup 6. Install Cable Harness for the Run II Term-Attn-Brd 7. Install Run II Term-Attn-Brd NOTES: Only complete steps 1 through 5 at this time. All work must be done at a static controlled workstation using wrist strap and normal static control measures. Steps 1 through 5 require about 1 hour to complete per board. There are 320 boards total in the system. 64 boards are required to get Calorimeter Triggering started for the Central Calorimeter. Ground CTFE OpAmp Socket Pins ----------------------------- Two Ground wires are added to each of the 8 OpAmp integrated circuit sockets. The OpAmps should be removed from their sockets while this work is being done. This prevents their tin plated leads from "soldering" themselves permanently into the sockets. See the next step before re-installing the OpAmps into their sockets. Ground the CTFE OpAmp socket pins 5 and 8. The grounded positive terminal of Tantalum Capacitor C270 is used to ground U296 pin 8 and the grounded terminal of ceramic capacitor C286 is used to ground U296 pins 5. The grounded positive terminal of Tantalum Capacitor C274 is used to ground U298 pin 8 and the grounded terminal of ceramic capacitor C287 is used to ground U298 pins 5. The grounded positive terminal of Tantalum Capacitor C278 is used to ground U300 pin 8 and the grounded terminal of ceramic capacitor C288 is used to ground U300 pins 5. The grounded positive terminal of Tantalum Capacitor C282 is used to ground U302 pin 8 and the grounded terminal of ceramic capacitor C289 is used to ground U302 pins 5. Example On the back of the board: - C270 + \ Run a wire from the grounded | positive terminal of C270 to /-----5 6 7 8 U296 pin 8. * C286 U296 Run a wire from the grounded * 4 3 2 1 terminal of C286 to U296 pin 5. The grounded negative terminal of Tantalum Capacitor C271 is used to ground U297 pin 8 and the grounded terminal of ceramic capacitor C272 is used to ground U297 pins 5. The grounded negative terminal of Tantalum Capacitor C275 is used to ground U299 pin 8 and the grounded terminal of ceramic capacitor C276 is used to ground U299 pins 5. The grounded negative terminal of Tantalum Capacitor C279 is used to ground U301 pin 8 and the grounded terminal of ceramic capacitor C280 is used to ground U303 pins 5. The grounded negative terminal of Tantalum Capacitor C283 is used to ground U303 pin 8 and the grounded terminal of ceramic capacitor C284 is used to ground U303 pins 5. Example C272 On the back of the board: * * - C271 + | \ Run a wire from the grounded \ | negative terminal of C271 to 5 6 7 8 U297 pin 8. U297 Run a wire from the grounded 4 3 2 1 terminal of C272 to U297 pin 5. Cut off lead number 5 from the OpAmps ------------------------------------- On each of the 8 OpAmps, fold up lead #5 and cut it off about 1 mm from the body of the integrated circuit. To find lead #5 orient the OpAmp so that you can read the printing on its top, leads down, notch to the left. Lead #5 is in the upper right hand pin. Use a smooth cutting motion (with no snap) to prevent fracturing the glass sealed integrated circuit package. Reinstall these 8 integrated circuits in their sockets. Remove the Run I Frequency Response Control Capacitors from the differential line Receiver Circuit. ------------------------------------------------------ Remove the following mica capacitors from the top side of the circuit board. These capacitors are all located near the OpAmp sockets from the previous steps. Just fold the capacitor body back and forth several time until it comes off. Do not bother to un-solder it leads. Total of 16 capacitors are removed in this step For Eta 1 EM & HD remove C295, C312 & C294, C307 For Eta 2 EM & HD remove C298, C314 & C297, C308 For Eta 3 EM & HD remove C301, C316 & C300, C309 For Eta 4 EM & HD remove C304, C318 & C303, C310 Replace the FADC Input Capacitor -------------------------------- Pull off the 330 pFd mica capacitors that feed the ADC's and replace them with 100 pFd 1206 SMD capacitors on the back of the boards. The 8 mica caps to be removed are reference designators: C220, C226, C232, C238, C244, C250, C256, and C262 Just fold them back and forth from the top side of the board until they come off. Do not remove their lead from the board. On the back side of the board solder on a new 100 pFd SMD 1206 capacitor in place of the capacitors just removed. The SMD capacitor can be soldered to the back of the board using the stubs of the leads from the old mica capacitor to help hold the SMD part in place while soldering. "Tack" solder one end first, then a good solder job at the other end, and finally a good solder job at the original end. ReWork the X_Clock Setup ------------------------ Remove U113 a 74AS04 from its socket. This chip is located about and inch and a half above and to the left of the dog. There is no need to remove the jumper in this socket between pins 1 & 2. Orient the board with chip side down, the 4 DIN connectors at the top, and the blue bar side closest to you. On this solder side of the board, locate U92, which is just above U113. Locate the trace that runs from pins 1 & 4 of U92 to the long vertical trace to the right of U92. We need to disconnect pins 1 & 4 of U92 from this long vertical trace. The best place to cut is the horizontal part of this connection just to the left of the long vertical trace. Do not cut too deeply and there is another trace that runs directly under neath the trace that you need to cut. With the board in the same orientation solder bridge pins 1 & 2 and pins 4 & 5 of U92. Also solder bridge pins 1 & 2 of U113. Install Cable Harness for the Run II Term-Attn-Brd (NOT AT THIS TIME) -------------------------------------------------- Add the cable harness for connection of the serial data signals to the Run II Term-Attn-Brd that plugs into the CTFE card. The connections are made to U235 and run on the top of the board. CTFE Board ------------ Board U235 CSR Pin Serial Data Bit Num DAC Function Wire Color ----- ---- --------------- ------------ 2 17 Chip Select * Green 3 16 Serial Data Yellow 4 15 Serial Clock Red 10 3x Grounds Black Install the Run II Term-Attn-Brd's (NOT AT THIS TIME) ---------------------------------- Fold down other components (e.g. mica cap's) as necessary or else cut them off. Above here is the 2001 version +++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++ Below here is the 2002 version February 2002 ECO List of CTFE Card Re-Work ----------------------------------------------- Original Rev. 14-FEB-2002 Current Rev. 28-FEB-2002 The current version of this file is on the web at: www.pa.msu.edu/hep/d0/ftp/l1/cal_trig/hardware/ctfe/run_ii_ctfe_rework.txt Please do not feel rushed with this job and take the time that you want to have good quality workmanship. Having all this work done accurately with good workmanship is much more important than getting these cards done quickly. All work must be done at a static controlled workstation using wrist strap and normal modern static control measures. General list of work to be done at this time: 6. Install Cable Harness for the Term-Attn-Brd 7. Install the Term-Attn-Brd 8. EM, HD, Px, Py Lookup PROM removal, re-programming, re-installation Please start this work with the 64 cards that are labeled: +5,1 ... +5.32 and -5,1 ... -5,32. At this time 15-FEB-02 we only want to work on these first 64 cards to verify what we are doing. 6. Install Cable Harness for the Term-Attn-Brd ----------------------------------------------- Install the cable harness for control signals to the Term-Attn-Brd that plugs into the CTFE card. These solder connections are made to pins on U235 and this cable runs on the top of the board. U235 Pin Num Wire Color ---------- ------------ 17 Green 16 Yellow 15 Red 10 3x Black Notes: You will probably need to either trim the tinned leads of the cable or bend them into a tight "U" where they are soldered to the side of the U235 pins. The cable harness must be run close to the top surface of the card so that it does not get caught by the next card in the crate. It is routed between U289 and U290. You may want to remove one of these socketed IC to accomplish this. To keep the cable down close to the surface of the card it is necessary to glue it in place. The cable should be glued to the board at about 3 or 4 points. Before glueing, the length of the cable that comes out between U289 and U290 should be adjusted so that there is clearly enought length for it to plug into the Term-Attn-Brd but not too much extra slack. If any of these cards still have Op-Amps U296 through U303 installed in their sockets, please remove them at this time and save these IC's in a box. 7. Install the Term-Attn-Brd's ------------------------------- Steps to complete at this time (15-FEB-02): Please remove the 2 mica capacitors from in front of each Lemo connector in order to make more space for the components on the Term-Attn-Brd's. Issues to be understood: Is there going to be a clearance problem between the SMD capacitors on the Term-Attn-Brd's and the Lemo connectors ? "Grind" off 1mm of the Lemo connector and air hose off the card ? What quality control inspections steps to we need to make before installing the Term-Attn-Brd's which then cover up much of the area where there has been re-work ? How to verify that all the pins on the Term-Attn-Brd are lined up with the socket on the CTFE card before pushing it in ? Answer, Don't let full professors do this step. How do we keep separate the Run II Term-Attn-Brd's for the Trigger Towers 1:8 from Trigger Towers 9:20 ? Roll the RF chokes towards the back of the CTFE card to make room for the Run II Term-Attn-Brd's ? 8. EM, HD, Px, Py Lookup PROM removal, re-programming, re-installation ------------------------------------------------------------------------ Steps to complete at this time 14-FEB-02 At this time remove the 8 EM and HD PROM's and keep them in neat rows and columns on a sheet of anti-static foam. These IC's are Cypress type CY7C245A. At the time remove the 8 Px and Py PROM's and keep them in neat rows and columns on a separate sheet of anti-static foam. These IC's are Cypress type CY7C291A. From the arrays of PROM's on the sheets of anti-static foam please remove their current labels. An exacto knife may be a good tool for this. Make sure that the sticky glue is removed from the glass windows. Issues to be understood: Where - who will erase the PROM's to get them ready for cooking ? When will the PROM Cooker Factory be ready to operate ? Where do we want to do the bulk of the PROM Cooking, SiDet or D-Zero ? Where to install the new Run II PROM's, SiDet or D-Zero ? How many handling steps ? perhaps 2: or can we make it one or is it an issue ? 1. install cable harness remove PROM's, remove mica cap, trim Lemo 2. Install Term-Attn-Brd's and the new PROM's Note about the first 64 cards +5,1 ... +5,32 and -5,1 ... -5,32 ------------------------------------------------------------------ The first 64 cards will be handled differently than the remaining about 200 cards. We want to check everything carefully with these first 64 cards to make certain that we have not forgotten something before releasing these instructions for working on the remaining 200 cards. Processing of the first 64 cards will be in two steps: First Step Install cable harness, remove the mica capacitors by the LEMO connectors, remove PROM's, and trim off the LEMO connectors if that is necessary. Second Step Install Term-Attn-Brd's and the new Run II PROM's Schedule for the first 64 cards: By Feb 20th I will have the parts to you so that you can begin processing the First Step on the first 64 cards. By the 1st of March we could use 2 cards processed just through the First Step. By mid March we should have the PROM Programming ready to go so that you could begin processing the first 64 cards through the Second Step. Once we have the first 64 cards processed through the First and Second Steps, my guess is that we will know that things are working well enoght to immediately release the remaining 200 cards for processing through the First Step. It may then take 2 or 3 weeks for us to watch the first 64 cards in operation before we are absolutely certain that we like the PROM's and thus can release the remain 200 cards for processing through the Second Step. Phone numbers: -------------- Daniel Mendoza x4114 Bob Kehoe x8653 Dan Edmunds x2832 or 517-355-8525 Using the PROM Eraser --------------------- Please be sure that all the old paper label and its glue are removed from the window before starting the erasing cycle. Getting the PROM's properly erased before starting the re-programming is important in making sure that the re-programming goes smoothly. The PROM's should be placed on a rectangular sheet of anti-static foam that fits within the marked area on the PROM Eraser tray. Using a larger piece of foam than the area marked on the tray would result in not all PROM's being directly exposed to the UV light. Please set the eraser for about 12 minutes for the first part of the erasing cycle. When this time is up open the tray and rotate the piece of anti-static foam end-for-end (180 degrees) and erase for a second period of 12 minutes. Doing the erasing this way in two steps helps ensure that no area of the PROM is shadowed during the erasing.